Surface Mounted Devices (SMD) is one of electronic components and assemblied in high density, small size and light weight. The volume and weight is only 1/10 of tranditional DIP components. Being replaced by SMD and through PCB assembly, the volume of electronic products is reduced 40% to 60% and the weight 60% to 80% and with high reliability and anti-vibration.
Specifications for Various SMD Components:
| Classification | Parameter | Picture |
| Tantalum |
Size & Specification: TANA,TANB,TANC,TANDSOT
|  |
| transistor | SOT23, SOT143, SOT89 etc. |  |
| MELF Cylindrical Element | DIODE, RESISTOR |  |
| SOIC Integrate Circuit | Dimensions: SOIC08, 14, 16, 18, 20, 24, 28, 32 |  |
| QFP Close pitch integrated circuit
PLCC integrate circuit
| PLCC20, 28, 32, 44, 52, 68, 84 |  |
BGA
Ball Grid Array Package Integrated Circuit
| Array Spacing Specifications: 1.27, 1.00, 0.80 |  |
| CSP Integrated Circuit | Element length does not exceed inside the length of the chip with 1.2 times Array spacing <0.50的MICROBGA |  |
Chip RESISTOR , CAP
| Dimensions: 0201,0402,0603,0805,1206,1210,2010, |  |
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